A 300mm silicon wafer. Liesa Johannssen-Koppitz/Bloomberg UMC, Taiwan’s No. 2 contract chip maker after TSMC, is pairing up with Toyota-backed car-parts supplier Denso to make semiconductors in Japan ...
A 300mm silicon wafer. Liesa Johannssen-Koppitz/Bloomberg UMC, Taiwan’s No. 2 contract chip maker after TSMC, is pairing up with Toyota-backed car-parts supplier Denso to make semiconductors in Japan ...